The wafer transfer platform is an indispensable component of semiconductor process equipment, mainly realizing the automated transfer of wafers in a clean and vacuum environment between different modules. The wafer transfer platform can quickly switch between atmospheric and vacuum states to meet system process requirements. This equipment mainly consists of components used to transfer wafers between different process modules during the process. This system includes a front-end VCE (Vacuum Cassette Elevator) for loading wafers and storing cassettes (which hold 6-inch or 8-inch wafers), a platform vacuum chamber, a vacuum robot, a vacuum aligner, a cooler assembly, a wafer separation module (WSM), etc. It is used to transfer 6-inch/8-inch wafers. The equipment has multiple interlocks to ensure the safety of personnel and equipment during wafer transfer.

The 300mm (nitrogen) wafer cassette transfer and storage system mainly consists of a wafer cassette FOUP loading system LoadPort, a wafer cassette FOUP storage shelf, a robot, a fully sealed FIMS, a nitrogen purge system N ₂ Purge, pneumatic system, and electrical control system, etc. It realizes the loading and unloading, temporary storage, nitrogen purge, and wafer cassette FOUP switching functions. The wafer cassette FOUP loading system in this product is divided into two stations A/B, used to realize the loading and unloading of wafer cassette FOUPs. The wafer cassette FOUP storage shelf has a total of 18 stations, which can store multiple wafer cassette FOUPs. During storage, the nitrogen purge system N ₂ Purge function is enabled, which can effectively reduce the oxygen content and humidity inside the wafer cassette FOUP. The robot is used for picking, placing, and handling between stations. The fully sealed FIMS can realize the wafer cassette FOUP switching function and ensure the sealing requirements between the stocker and the process equipment.

The Grail B1203A wafer transfer system achieves wafer box (Foup) input and output through interaction with the customer's overhead hoist (OHT) system. It realizes inter-process stage transfer, conveyance, and storage of Foups through a FOUP robotic arm. Internal loadports enable Foup opening and mapping. The wafer transfer, merging, and splitting are accomplished through the wafer transfer system (WTS). Wafer status confirmation and data comparison are achieved through mapping at three locations. 50P wafer caching is realized through a fixed buffer (BF). Interfacing with the cleaning process robot is handled through a pan-tilt-zoom (PTZ) system. The top electrostatic field unit (EFU) maintains a cleanroom environment within the machine, and the top ion bars remove electrostatic residue from the transfer path.