PC300 Pressure Controller

The PC300 Series Pressure Controller regulates backside cooling gas pressure for wafers with integrated flow measurement capability, primarily deployed in CVD and Etch process equipment within integrated circuit manufacturing systems.

Advantages

High Pressure Control Accuracy

Pressure control accuracy range: ±0.2% F.S.

Customizable

Can be customized according to different customer needs non-conventional range, different sizes, different interfaces (including electrical, mechanical).

Fast Response

Product response time: < 1.0 sec.

Dual Power Supply in a Wide Range

+15 VDC power supply, dual power supply in a wide range, low current and low power consumption.

Innovation

Product Digitization

The product adopts advanced microprocessor, which has the advantages of high intelligence, high reliability and convenient maintenance.

Dual Control Technology

The product employs dual flow and pressure control technology, achieving "high responsiveness" and "high precision" performance configuration.

Application areas

Semiconductor-Integrated Circuit

Semiconductor-Advanced Packaging

Semiconductor display

Semiconductor lighting

Semiconductor-Microelectromechanical Systems

Power semiconductor

Compound semiconductor

Technical indicators

Model PC300
Full Scale Flow Rate (10 20 50 100 200 500 1000 2000 5000) SCCM
Full Scale Pressure (10 20 50 100) Torr
Control Method Downstream
Pressure Control Accuracy ±0.2% of F.S.
Control Repeatability ±0.2% of F.S.
Response Time <1.0 Second
Operating Temperature Range 10℃ to 50℃
Valve Type Normally Closed
Leak Rate <1x10^-12 (SCCM/SEC He) -12 (SCCM/SEC He)

PC300 Series Chinese Product Manual

2024-11-27

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