PC300 Pressure Controller
The PC300 Series Pressure Controller regulates backside cooling gas
pressure for wafers with integrated flow measurement capability, primarily
deployed in CVD and Etch process equipment within integrated circuit
manufacturing systems.
Advantages
High Pressure Control Accuracy
Pressure control accuracy range: ±0.2% F.S.
Customizable
Can be customized according to different customer needs non-conventional range, different sizes, different interfaces (including electrical, mechanical).
Fast Response
Product response time: < 1.0 sec.
Dual Power Supply in a Wide Range
+15 VDC power supply, dual power supply in a wide range, low current and low power consumption.
Innovation
Product Digitization
The product adopts advanced microprocessor, which has the advantages of high intelligence, high reliability and convenient maintenance.
Dual Control Technology
The product employs dual flow and pressure control technology, achieving "high responsiveness" and "high precision" performance configuration.
Application areas
Semiconductor-Integrated Circuit
Semiconductor-Advanced Packaging
Semiconductor display
Semiconductor lighting
Semiconductor-Microelectromechanical Systems
Power semiconductor
Compound semiconductor
Technical indicators
Model | PC300 |
Full Scale Flow Rate | (10 20 50 100 200 500 1000 2000 5000) SCCM |
Full Scale Pressure | (10 20 50 100) Torr |
Control Method | Downstream |
Pressure Control Accuracy | ±0.2% of F.S. |
Control Repeatability | ±0.2% of F.S. |
Response Time | <1.0 Second |
Operating Temperature Range | 10℃ to 50℃ |
Valve Type | Normally Closed |
Leak Rate | <1x10^-12 (SCCM/SEC He) -12 (SCCM/SEC He) |
Contact Us
If you have any questions, please leave your detailed requirements information here, and we will be happy to serve you.
